The application of intelligence/AI technologies is expected to accelerate widely in 2030 and beyond, creating new opportunities for the development of SDVs.
In particular, the MOU outlines areas of potential joint research of specialized semiconductor technologies such as brain-inspired computing(2) and chiplet technologies, with the aim to dramatically improve processing performance while, simultaneously, decreasing power consumption. Hardware and software co-optimization is important to ensure high performance and fast time to market. To achieve such benefits and manage design complexity for future SDVs, the two companies also plan to explore open and flexible software solutions.
Through this collaboration, the two companies would strive to realize SDVs that feature the world's top-level computing and power saving performance.
(1) Computing technology being developed with an aim to achieve both high processing performance and low power consumption in the 2030s and beyond.
(2) Computer architecture and algorithms that mimic the brain's structure and function while optimizing for silicon.
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