Infineon Technologies : New EasyPACK™ 2B EDT2 power module for traction inverters up to 50 kW
October 04, 2021 at 03:46 am EDT
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New EasyPACK™ 2B EDT2 power module for traction inverters up to 50 kW
Oct 4, 2021| Market News
Munich, Germany - 4 October, 2021 - Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces the automotive qualified EasyPACK™ 2B EDT2, a flexible and scalable half-bridge power module. Depending on inverter conditions, this 750 V device can reach a maximum power of up to 50 kW and 230 A rms. With its featured specs, the module is optimized for inverter applications in hybrid and electric vehicles.
Over the past ten years, Infineon has sold more than 50 million EasyPACK modules with various chipsets for a wide range of industrial and automotive applications. With the introduction of the EDT2 (Electric Drive Train) technology in this package and full automotive qualification, Infineon is now expanding the application range of the module family to include traction inverters. The key feature of the EDT2 technology is the higher efficiency at low-load conditions. An EDT2 chip ensures significantly lower losses than current products on the market and even outperforms Infineon's previous chip generation by 20 percent.
Another unique feature of the EasyPACK is the plug-and-play approach, which simplifies module integration. In addition, compared to classic through-hole discrete packages as well as the HybridPACK™ 1, soldering of the pins is no longer required. Infineon's PressFIT contact technology enables a reduction in mounting time. Thanks to the package size, three EasyPACK 2Bs require 30 percent less surface area than a HybridPACK 1. For this reason they offer not only a very compact but also a cost-effective design. Furthermore, the EasyPACK 2B EDT2 is fully qualified to the AQG324 standard.
Availability
The new EasyPACK 2B EDT2 module FF300R08W2P2_B11A will be available starting in October 2021. Further information is available at www.infineon.com/easyinverter.
More information about Infineon's contribution to energy efficiency: www.infineon.com/green-energy
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Information Number
INFATV202110-001
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Infineon has sold more than 50 million EasyPACK™ modules with various chipsets for a wide range of industrial and automotive applications. With the introduction of the EDT2 (Electric Drive Train) technology in this package and full automotive qualification, Infineon is now expanding the application range of the module family to include traction inverters. An EDT2 chip ensures significantly lower losses than current products on the market and even outperforms Infineon's previous chip generation by 20 percent.
EasyPACK_2B_EDT2
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Infineon Technologies AG published this content on 04 October 2021 and is solely responsible for the information contained therein. Distributed by Public, unedited and unaltered, on 04 October 2021 07:44:39 UTC.
Infineon Technologies AG is one of the world's leading manufacturers of semiconductors. The group's products include power semiconductors, sensors, microcontrollers, digital, mixed-signal and analog ICs, discrete semiconductor modules, switches, interface ICs, motor-controlling ICs, RF power transistors, voltage regulators, and electronic safety components. Net sales break down by area of activity as follows:
- automotive (50.5%): semiconductor products used in the automotive industry, and memory products for specific applications for automotive, industrial, information technologies, telecommunications and consumer electronics.
- power & sensor systems (23.3%): semiconductors for energy-efficient power supplies, mobile devices, mobile phone network infrastructures, human-machine interaction as well as applications with special demands on their robustness and reliability.
- industrial power control (13.5%): semiconductor products for the conversion of electrical energy for small, medium and high-power applications, used in the manufacturing, the low-loss transmission, the storage and the efficient use of electrical energy;
- connected secure systems (12.6%): semiconductors for networked devices, card-based applications, and government documents; microcontrollers for industrial, entertainment, and household applications, components for connectivity systems, various customer support systems;
- other (0.1%).
Net sales are distributed geographically as follows: Germany (12.4%), Europe/Middle East/Africa (14.4%), China/Hong Kong/Taiwan (32.3%), Japan (10.5%), Asia/Pacific (15.9%), the United States (12.1%) and Americas (2.4%).