Important resolution of the company's 2022
shareholders' meeting
Date of events
2022/06/10
To which item it meets
paragraph 18
Statement
1.Date of the shareholders meeting:2022/06/10
2.Important resolutions (1)Profit distribution/ deficit
compensation:
Acknowledge of 2021 earning distribution.:Approved.
3.Important resolutions (2)Amendments to the corporate charter:
Discussion of amendments to the company's "Articles of Incorporation ."
:Approved.
4.Important resolutions (3)Business report and financial statements:
Acknowledge of 2021 business report and financial statements.
:Approved.
5.Important resolutions (4)Elections for board of directors and
supervisors:
To elect the company's 20th term of directors.
The list of newly-elected directors:
Directors :
Shu-Chyuan Yeh
Tse-Sung Tsai
Sheunn-Ching Yang
Ming-Te Tu
Shu-Hsun Yeh
Pin-Wen Fang
Independent Directors :
Feng-Hsien Shih
Wan-Ping Chen
Pin-Chi Wei
6.Important resolutions (5)Any other proposals:
1.Discussion of amendments to the company's "Procedures for Acquisition
and Disposal of Assets.":Approved.
2.Discussion of amendments to the company's "The Rules of Procedure for
Shareholders' Meetings.":Approved.
3.Discussion to approve the lifting of non-competition restrictions
on directors.:Approved.
7.Any other matters that need to be specified:
None.
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Disclaimer
Lingsen Precision Industries Ltd. published this content on 10 June 2022 and is solely responsible for the information contained therein. Distributed by Public, unedited and unaltered, on 10 June 2022 08:21:10 UTC.
LINGSEN PRECISION INDUSTRIES, LTD. is a Taiwan-based company principally engaged in the packaging, processing, testing and distribution of integrated circuits (ICs) and semiconductor components. The Company mainly operates its businesses through packaging and testing of ICs and semiconductor products, including small outline package (SOP), shrink small outline package (SSOP), thin small outline package (TSOP), thin shrink small outline package (TSSOP), plastic leadless chip carrier (PLCC), quad flat package (QFP), thin quad flat package (TQFP) services, as well as photo detect ICs (PD-ICs) and others. Its products are applied in the consumer electronics, automobile electronic products, memory products, communication equipment and power management products. The Company conducts its businesses primarily in Taiwan, the Americas, the rest of Asia and Europe.
LINGSEN PRECISION INDUSTRIES, LTD. 