Lingsen Precision Industries, Ltd. Reports Earnings Results for the Full Year Ended December 31, 2018
March 21, 2019 at 04:59 pm EDT
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Lingsen Precision Industries, Ltd. announced earnings results for the full year ended December 31, 2018. For the full year, the company announced sales was TWD 5,242.959 million compared to TWD 6,063.665 million a year ago. Operating loss was TWD 275.441 million compared to operating Income of TWD 127.985 million a year ago. Net loss was TWD 207.272 million compared to net income of TWD 130.985 million a year ago. Basic loss per share was TWD 0.55 compared to basic earnings per share of TWD 0.35 a year ago.
LINGSEN PRECISION INDUSTRIES, LTD. is a Taiwan-based company principally engaged in the packaging, processing, testing and distribution of integrated circuits (ICs) and semiconductor components. The Company mainly operates its businesses through packaging and testing of ICs and semiconductor products, including small outline package (SOP), shrink small outline package (SSOP), thin small outline package (TSOP), thin shrink small outline package (TSSOP), plastic leadless chip carrier (PLCC), quad flat package (QFP), thin quad flat package (TQFP) services, as well as photo detect ICs (PD-ICs) and others. Its products are applied in the consumer electronics, automobile electronic products, memory products, communication equipment and power management products. The Company conducts its businesses primarily in Taiwan, the Americas, the rest of Asia and Europe.
LINGSEN PRECISION INDUSTRIES, LTD. 
