Lingsen Precision Industries, Ltd. Announces Cash Dividend, Payable on August 25, 2023
May 30, 2023 at 05:22 am EDT
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Lingsen Precision Industries, Ltd. announced cash dividends to common shareholders is TWD 114,030,704. Ex-rights (ex-dividend) trading date is July 31, 2023. Ex-rights (ex-dividend) record date is August 6, 2023. The cash dividend will be payable on August 25, 2023.
Lingsen Precision Industries, Ltd. announced cash dividends to common shareholders is TWD 490,000,000. Ex-rights (ex-dividend) trading date is August 4, 2022. Ex-rights (ex-dividend) record date is August 10, 2022. The cash dividend will be payable on August 31, 2022.
LINGSEN PRECISION INDUSTRIES, LTD. is a Taiwan-based company principally engaged in the packaging, processing, testing and distribution of integrated circuits (ICs) and semiconductor components. The Company mainly operates its businesses through packaging and testing of ICs and semiconductor products, including small outline package (SOP), shrink small outline package (SSOP), thin small outline package (TSOP), thin shrink small outline package (TSSOP), plastic leadless chip carrier (PLCC), quad flat package (QFP), thin quad flat package (TQFP) services, as well as photo detect ICs (PD-ICs) and others. Its products are applied in the consumer electronics, automobile electronic products, memory products, communication equipment and power management products. The Company conducts its businesses primarily in Taiwan, the Americas, the rest of Asia and Europe.
LINGSEN PRECISION INDUSTRIES, LTD. 
