Korea S.E.
06:00:00 2024-05-15 pm EDT
5-day change
1st Jan Change
4,280
KRW
+1.90%
+3.88%
-12.21%
RN2 Technologies Co., Ltd. announced that it expects to receive KRW 20 billion in funding
RN2 Technologies Co., Ltd. (KOSDAQ:A148250) announced a private placement of series 4th unregistered coupon nonguaranteed non detachable private bonds with warrants for gross proceeds of KRW 20,000,000,000 on January 21, 2020. The transaction is expected to close on January 25, 2021. The transaction has been approved by the board of directors.
RN2 Technologies Co., Ltd. announces an Equity Buyback for KRW 1,000 million worth of its shares.
Feb. 28
CI
RN2 Technologies Co., Ltd. authorizes a Buyback Plan.
Feb. 28
CI
RN2 Technologies Co., Ltd. Reports Earnings Results for the Full Year Ended December 31, 2022
23-03-20
CI
RN2 Technologies Co., Ltd. cancelled the transaction announced on October 18, 2022
23-02-23
CI
Automobile & PCB Inc. cancelled the acquisition of 5.71% stake in RN2 Technologies Co., Ltd. from Lee, Hyo-Jong.
23-02-01
CI
Automobile & PCB Inc. agreed to acquire 5.71% stake in RN2 Technologies Co., Ltd. from Lee, Hyo-Jong for KRW7.01 billion.
22-10-17
CI
RN2 Technologies Co., Ltd. announced that it expects to receive KRW 30.024008 billion in funding from Automobile & PCB Inc. and others
22-10-17
CI
Tranche Update on RN2 Technologies Co., Ltd.'s Equity Buyback Plan announced on February 15, 2022.
22-08-16
CI
Tranche Update on RN2 Technologies Co., Ltd.'s Equity Buyback Plan announced on February 15, 2022.
22-08-16
CI
RN2 Technologies Co., Ltd.'s Equity Buyback announced on February 15, 2022, has expired with 251,212 shares, representing 3.34% for KRW 2,681.49.
22-08-15
CI
Tranche Update on RN2 Technologies Co., Ltd.'s Equity Buyback Plan announced on February 15, 2022.
22-05-17
CI
RN2 Technologies Co., Ltd. announces an Equity Buyback for KRW 4,000 million worth of its shares.
22-02-14
CI
RN2 Technologies Co., Ltd. authorizes a Buyback Plan.
22-02-14
CI
RN2 Technologies Co., Ltd. announced that it has received KRW 20 billion in funding
21-01-24
CI
RN2 Technologies Co., Ltd. announced that it expects to receive KRW 20 billion in funding
21-01-20
CI
Tranche Update on RN2 Technologies Co., Ltd.'s Equity Buyback Plan announced on March 17, 2020.
20-09-16
CI
Tranche Update on RN2 Technologies Co., Ltd.'s Equity Buyback Plan announced on March 17, 2020.
20-09-16
CI
Tranche Update on RN2 Technologies Co., Ltd.'s Equity Buyback Plan announced on March 17, 2020.
20-09-16
CI
RN2 Technologies Co., Ltd.'s Equity Buyback announced on March 17, 2020, has expired with 74,091 shares, representing 1.06% for KRW 655.25 million.
20-09-15
CI
RN2 Technologies Co., Ltd. announces an Equity Buyback for KRW 2,000 million worth of its shares.
20-03-17
CI
RN2 Technologies Co., Ltd. authorizes a Buyback Plan.
20-03-16
CI
RN2 Technologies Co., Ltd. announced that it has received KRW 10 billion in funding from ANDA Asset Management Co., Ltd., Samsung Securities Co.,Ltd., Mirae Asset Daewoo Co., Ltd., NH Investment & Securities Co., Ltd., Korea Investment & Securities Co., Ltd., KEB Hana Bank Co., Ltd.
19-11-10
CI
RN2 Technologies Co., Ltd. announced that it expects to receive KRW 10 billion in funding from ANDA Asset Management Co., Ltd., Samsung Securities Co.,Ltd., Mirae Asset Daewoo Co., Ltd., NH Investment & Securities Co., Ltd., Korea Investment & Securities Co., Ltd., KEB Hana Bank Co., Ltd.
19-11-06
CI
RN2 Technologies Co., Ltd. announced that it has received KRW 6 billion in funding from Kiwoom Securities Co., Ltd., Investment Arm
17-11-19
CI
RN2 Technologies Co., Ltd. announced that it expects to receive KRW 6 billion in funding from Kiwoom Securities Co., Ltd., Investment Arm and other investors
17-11-15
CI
Duration Auto. 2 months 3 months 6 months 9 months 1 year 2 years 5 years 10 years Max.
Period Day Week
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RN2 TECHNOLOGIES CO., LTD. is a Korea-based company primarily engaged in the manufacture and distribution of low temperature co-firing ceramic (LTCC) solutions. The Company operates its business through three segments: component segment, substrate segment and material segment. The component segment mainly produces couplers, delay lines and terminations for communication industry. The substrate segment provides LTCC substrates and foundry services for medical image diagnosis devices and manufacturing device development business. The material segment manufactures LTCC powders of high and low dielectric for communicational device business. The Company distributes its products within domestic market and to overseas markets.
More about the company
1st Jan change
Capi.
-12.21% 22.94M +32.93% 79.26B +64.11% 73.54B -5.88% 34.23B -7.81% 30.47B -9.40% 13.93B -7.26% 10.47B +11.21% 9.88B -7.51% 9.76B +34.00% 8.7B
Electronic Component
+951% of historical
More than 20 years
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