Hongtong Technology (Xiamen) Co., Ltd. announced that it has entered into an agreement to raise CNY 221.35 million in a equity funding on April 26, 2024. The transaction will include participation from returning investors, TES Touch Embedded Solutions (Xiamen) Co., Ltd. for CNY 154.945 million of which CNY 66.5 million was included in the registered capital and CNY 88.445 million was included in the capital reserve and TPK Glass Solutions (Xiamen) Inc. for CNY 66.405 million of which CNY 28.5 million was included in the registered capital and CNY 37.905 million was included in the capital reserve. The transaction has been approved at the 26th meeting of the company's second board of directors and second special meeting of independent directors in 2024.
TES Touch Embedded Solutions (Xiamen) Co., Ltd.
Equities
003019
CNE1000048M4
Electronic Equipment & Parts
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5-day change | 1st Jan Change | ||
27.19 CNY | -1.38% | -3.48% | +20.31% |
Annual profits - Rate of surprise
1st Jan change | Capi. | |
---|---|---|
+20.31% | 602M | |
+13.80% | 108B | |
-5.08% | 29.57B | |
+5.38% | 20.93B | |
-11.78% | 18.67B | |
+15.85% | 16.28B | |
-13.22% | 16.03B | |
+10.90% | 13.57B | |
-2.01% | 10.8B | |
+2.22% | 8.44B |
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- Hongtong Technology Co., Ltd. announced that it expects to receive CNY 221.35 million in funding from TPK Glass Solutions Inc., TES Touch Embedded Solutions Co., Ltd.