Winbond Electronics Corporation

2344

TW0002344009

Semiconductors

End-of-day quote Taiwan S.E. Other stock markets 06:00:00 2024-04-25 pm EDT			5-day change	1st Jan Change
25.15 ^TWD	-0.20%		-0.98%	-17.41%

Apr. 26	Fih Co Enters into Joint Venture Agreement	CI
Apr. 01	Winbond Extends Its Secure Flash Family with New Memory Densities, PQC Support and Secure Supply Chain Management	CI

Winbond Electronics Corporation Announces Cash Dividend, Payable on October 6, 2023

September 05, 2023 at 06:41 am EDT

Winbond Electronics Corporation announced total cash dividends to common shareholders will be TWD 3,980,000,193(TWD 1 per share). Ex-rights (ex-dividend) trading date: September 20, 2023; Ex-rights (ex-dividend) record date: September 26, 2023. Payment date of cash dividend distribution: October 6, 2023.

Latest news about Winbond Electronics Corporation

Fih Co Enters into Joint Venture Agreement	Apr. 26	CI
Winbond Extends Its Secure Flash Family with New Memory Densities, PQC Support and Secure Supply Chain Management	Apr. 01	CI
Winbond Electronics Corporation Reports Earnings Results for the Full Year Ended December 31, 2023	Feb. 06	CI
Winbond Electronics Corporation Sign the Solar Power Procurement Agreement with Chenhwa Power Co., Ltd	Feb. 06	CI
Winbond Electronics Corporation announced that it expects to receive TWD 1.199999988 billion in funding from Walsin Lihwa Corporation	Nov. 02	CI
Winbond Electronics Corporation Reports Earnings Results for the Third Quarter and Nine Months Ended September 30, 2023	Nov. 02	CI
United Microelectronics Corporation Announces Initiates the W2w 3D IC Project in Collaboration with Partners Winbond, Faraday, ASE, and Cadence	23-10-31	CI
Winbond Electronics Corporation Announces Cash Dividend, Payable on October 6, 2023	23-09-05	CI
Winbond Electronics Corporation announced that it expects to receive TWD 2 billion in funding	23-08-17	CI
Winbond Electronics Corporation Reports Earnings Results for the Second Quarter and Six Months Ended June 30, 2023	23-08-04	CI
Mobiveil and Winbond Partner to Deliver HYPERRAM IP Controller to SoC Designers	23-08-02	CI
Winbond Electronics Corporation Announces 8Mb 3V NOR W25Q80RV	23-06-19	CI
Winbond Electronics Corporation Announces the Replacement of Members of Compensation Committee	23-05-30	CI
Winbond Electronics Corporation Announces the Change of the Audit Committee Members	23-05-30	CI
Winbond Electronics Corporation Reports Earnings Results for the First Quarter Ended March 31, 2023	23-05-04	CI
Winbond Electronics Corporation and STMicroelectronics Partner to Combine High-Performance Memory with STM32 Devices in Smart Industrial and Consumer Applications	23-03-15	CI
Winbond Electronics Corporation Proposes Dividend Distribution for the Second Half Period from July 1, 2022 to December 31, 2022	23-03-14	CI
Winbond Electronics Corporation Reports Earnings Results for the Full Year Ended December 31, 2022	23-02-17	CI
Winbond Electronics Corporation Announces Executive Changes	23-02-16	CI
Winbond Electronics Corporation Announces Appointment of Shui-Pao Wu as Chief Information Security Officer	22-11-30	CI
Winbond Electronics Corporation Adopts Low Temperature Soldering to Slow the Pace of Global Warming	22-11-16	CI
Winbond Electronics to Slash Production by Over 30%	22-11-15	MT
Winbond Electronics Corporation Reports Earnings Results for the Third Quarter and Nine Months Ended September 30, 2022	22-11-03	CI
Winbond Electronics Corporation Receives ISO/SAE 21434 Certification from TUV NORD for Road Vehicles Cybersecurity Management System	22-09-01	CI
Winbond Electronics Corporation Appoints Eungjoon Park as Chief Strategy Officer	22-08-04	CI

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Company Profile

WINBOND ELECTRONICS CORP. is a Taiwan-based company principally engaged in the research, development, design, manufacture and sales of integrated circuits (ICs) and memory products. The Companyâs products mainly include logic ICs, dynamic random access memory (DRAM) products, including mobile RAM products, specialty DRAM products and graphics DRAM products, as well as flash memory products and others. The Companyâs products are primarily applied in computers, communications and consumer electronics (3Cs), such as personal computers, wireless networks, set-top boxes, televisions, digital cameras and others. The Company distributes its products both in domestic markets and to overseas markets.

Sector

Semiconductors

Calendar

2024-05-01 - Q1 2024 Earnings Release (Projected)

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Ratings for Winbond Electronics Corporation

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Analysts' Consensus

Sell

Buy

Mean consensus

OUTPERFORM

Number of Analysts

Last Close Price

25.15 TWD

Average target price

31.85 TWD

Spread / Average Target

+26.64%

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