Mobiveil, Inc. announced a partnership with Winbond to deliver an IP controller targeting automotive, smart IoT, industrial, wearables, true wireless stereo (TWS), wireless headsets, smart Speakers and connectivity applications. Mobiveil adapted its HYPERRAM?? controller to leverage the unique characteristics of Winbond's HYPERRAM device that offers speeds of up to 250MHz and densities from 32Mb to 512Mb supporting x8/x16 modes.

SoC designers are affordable high-performance and low-power gains with 10x higher density than eSRAM, achieve 10x lower power compared to standard DRAM and 2x lower power consumption compared to PSRAM with approximately 2x fewer pin count than PSRAM. The HYPERRAM device from Winbond supports the HYPERBUS Interface for speeds of up to 500Mbps (x8 I/O) with 13 signal pins. The Mobiveil HYPERRAM controller provides support for an AXI memory mapped system interface, linear, hybrid and wrap burst and low power features such as deep power down and hybrid sleep mode.

It also supports the AMBA®? 3 AHB-Lite system interface. Winbond has positioned itself as the market leader in HYPERRAM devices and provides a complete product line of high-quality memory solutions in the IOT and wearables market segments.

Winbond continuously launches competitive products and provides customized memory solutions based on customers' special requirements and has shipped more than 400 million HYPERRAM devices from its inception. The HYPERRAM controller is now available. Pricing is available on request.