Winbond Electronics Corporation announced a private placement to issue 200,000,000 common shares at an issue price of TWD 10 per share for the gross proceeds of TWD 2,000,000,000 on August 18, 2023. The transaction has been approved by the shareholders of the company.
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Apr. 26 | Fih Co Enters into Joint Venture Agreement | CI |
Apr. 01 | Winbond Extends Its Secure Flash Family with New Memory Densities, PQC Support and Secure Supply Chain Management | CI |
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- Winbond Electronics Corporation announced that it expects to receive TWD 2 billion in funding