Aehr Test Systems announced it has received a $10.8 million single purchase order from its lead silicon carbide test and burn-in customer for multiple FOX-XP systems and full sets of WaferPak Contactors to meet their increased production capacity needs. This customer is a leading Fortune 500 supplier of semiconductor devices with a significant customer base in the automotive semiconductor market. These FOX systems and WaferPaks are expected to ship within the next six months. The FOX-XP system, available with multiple WaferPak Contactors (full wafer test) or multiple DiePak Carriers (singulated die/module test) configurations, is capable of functional test and burn-in/cycling of integrated devices such as silicon carbide power devices, silicon photonics as well as other optical devices, 2D and 3D sensors, flash memories, Gallium Nitride (GaN), magnetic sensors, microcontrollers, and other leading-edge ICs in either wafer form factor, before they are assembled into single or multi-die stacked packages, or in singulated die or module form factor.