Aehr Test Systems announced it has received purchase orders from a new customer for a FOX-NP multi-wafer test and burn-in system, multiple WaferPak Contactors and a FOX WaferPak Aligner to be used for qualification of their silicon carbide devices for electric vehicles. The order for WaferPaks from this customer was announced during Aehr's earnings conference call last week. This company is a multibillion-dollar annual revenue global manufacturer of semiconductors that is currently supplying silicon based MOSFETs for the automotive industry.

This FOX system is configured for High Temperature Gate Bias (HTGB) and High Temperature Reverse Bias (HTRB) stress testing and burning in of silicon carbide devices on 150mm and 200mm wafers using Aehr's proprietary WaferPak full wafer Contactors. The FOX system, WaferPaks, and WaferPak Aligner are scheduled to ship within the next six months. The FOX-NP system is a dual-wafer system that is fully compatible with the volume production FOX-XP, which can be configured with up to nine or eighteen wafers depending on the customer's specific test requirements and power configuration.

This allows customers to bring up initial production for customer qualifications as well as maintain 100% compatibility of systems, WaferPaks, test programs, and results between both new product introduction systems and volume production systems at facilities located around the world. This FOX system is configured for High Temperature Gate Bias (HTGB) and High Temperature Reverse Bias (HTRB) stress testing and burning in of silicon carbide devices on 150mm and 200mm wafers using Aehr's proprietary WaferPak full wafer Contactors. The FOX system, WaferPaks, and WaferPak Aligner are scheduled to ship within the next six months.

The FOX-XP and FOX-NP systems, available with multiple WaferPak Contactors (full wafer test) or multiple DiePak Carriers (singulated die/module test) configurations, are capable of functional test and burn-in/cycling of devices such as silicon carbide and gallium nitride power semiconductors, silicon photonics as well as other optical devices, 2D and 3D sensors, flash memories, magnetic sensors, microcontrollers, and other leading-edge ICs in either wafer form factor, before they are assembled into single or multi-die stacked packages, or in singulated die or module form factor.