Corning Incorporated : to Showcase Innovations that Support Artificial Intelligence and Address Critical Industry Needs at the 2024 Optical Fiber Communication Conference and Exposition

Optical Communications

Corning to Showcase Innovations that Support Artificial Intelligence and Address Critical Industry Needs at the 2024 Optical Fiber Communication Conference and Exposition

Corning to Showcase Innovations that Support Artificial Intelligence and Address Critical Industry Needs at the 2024 Optical Fiber Communication Conference and Exposition

CORNING, N.Y. | Corning Incorporated | March 21, 2024

New solutions accelerate installation and increase density as network builds intensify

CORNING, N.Y. - Corning Incorporated (NYSE:GLW) will showcase the next generation of optical network solutions at the 2024 Optical Fiber Communication Conference and Exposition (OFC). These latest innovations are designed to prepare data centers for the rapid growth of artificial intelligence applications and to help carrier networks simplify and accelerate their deployments and connect the unconnected.

What: Optical Fiber Communication Conference and Exposition
When: March 24 - 28
Where: Booth 2841, San Diego Convention Center, San Diego, California

"Optical connectivity is rapidly advancing the way we work, learn, and live. To keep this momentum going, operators must increase network density while meeting aggressive build timelines, all during a skilled-labor shortage," said Michael O'Day, Chief Technology Officer, Corning Optical Communications. "Corning is helping companies overcome these challenges with innovations that are denser, more cost-effective and sustainable than legacy solutions, and easier to install. We're moving the world forward with every connection."

Among the technologies that Corning experts will showcase are:

• RocketRibbon® cable with Flow Ribbon Technology, the latest addition to Corning's flow-ribbon cable portfolio, with fiber counts ranging from 1728 to 6912. Designed to increase density, maximize duct space, and ease installations for data center and carrier applications, these cables contain bend-resilient Corning® SMF-28® Contour 190-micron optical fiber arranged into an innovative flowing ribbon configuration. The cable's thin-film subunits route directly into hardware without the need for an additional layer of protection, reducing cable preparation time by up to 30%. Corning cables with Flow Ribbon Technology can reduce carbon footprint by up to 60% compared to legacy solutions due to their smaller outer diameter and more efficient use of materials.
  
  
• A new Corning high-density assembly, integrating a compact MMC solution offering 16-fiber and 24-fiber count configurations, designed to facilitate scalable growth, optimize space, and accelerate build timelines - critical capabilities for data centers as more AI applications emerge.
  
  
• EDGE™ Distribution System, an award-winning, pre-engineered data-center solution designed to shorten installation time for server cabling by up to 70%, address shortages in skilled labor, and provide up to a 55% reduction in carbon footprint by minimizing materials and packaging. The system is a single, integrated multi-fiber cable assembly allowing operators to drop fiber connections at individual server racks. With a robust cable jacket and streamlined packaging, it is an ideal solution for operators who want to quickly and efficiently interconnect leaf switches with top-of-rack switches within a server row.
  
  
• Corning's new Multifiber Pushlok™ Technology, the latest advancement in Corning's Evolv® portfolio of hardened connectivity solutions for carrier networks. It consists of cable assemblies, connectors, and terminals designed to accelerate Fiber-to-the-Home deployments and increase network density, scalability, and flexibility. It supports operators' sustainability objectives by reducing packaging material per assembly by up to 30%. By reducing reliance on skilled labor during deployment, the system also facilitates cost savings of at least $25 per home passed compared to traditional splice methods.

Corning experts will also demonstrate an extended data transmission in a high-speed, bi-directional transceiver with the Corning® ClearCurve® OM4 XT multimode fiber, a new bend-resilient fiber engineered for 400G/800G systems in AI and data center applications.

In addition, Cisco and Infinera will respectively conduct a series of demonstrations using Corning's lowest-loss fiber designed to support high-capacity long-haul and subsea networks, Corning® Vascade® EX2500 optical fiber. Visit Infinera's booth #2825 and Cisco's conference room #24B for more information.

For more information on Corning's full range of optical solutions, visit our products page. For images of the solutions on display, visit our media resources center.

About Corning Incorporated

Corning (www.corning.com) is one of the world's leading innovators in materials science, with a 170-year track record of life-changing inventions. Corning applies its unparalleled expertise in glass science, ceramic science, and optical physics along with its deep manufacturing and engineering capabilities to develop category-defining products that transform industries and enhance people's lives. Corning succeeds through sustained investment in RD&E, a unique combination of material and process innovation, and deep, trust-based relationships with customers who are global leaders in their industries. Corning's capabilities are versatile and synergistic, which allows the company to evolve to meet changing market needs, while also helping our customers capture new opportunities in dynamic industries. Today, Corning's markets include optical communications, mobile consumer electronics, display, automotive, solar, semiconductors, and life sciences.