Hua Hong Semiconductor Limited proposed final dividend for the year ended 31 December 2023 of HKD 0.165 per share. Date of shareholders' approval: 9 May 2024. Ex-dividend date: 3 June 2024.
Record date: 6 June 2024. Payment date: 26 June 2024.
Delayed
Other stock markets
|
5-day change | 1st Jan Change | ||
17.56 HKD | -1.68% | +9.07% | -6.99% |
May. 13 | SMIC, Hua Hong Boost Capacity Usage in Q1 | MT |
May. 13 | Jefferies Adjusts Hua Hong Semiconductor's Price Target to HK$18.03 From HK$17, Keeps at Hold | MT |
Hua Hong Semiconductor Limited proposed final dividend for the year ended 31 December 2023 of HKD 0.165 per share. Date of shareholders' approval: 9 May 2024. Ex-dividend date: 3 June 2024.
Record date: 6 June 2024. Payment date: 26 June 2024.
1st Jan change | Capi. | |
---|---|---|
-6.99% | 4.74B | |
+84.48% | 2,225B | |
+39.12% | 655B | |
+23.63% | 620B | |
+3.90% | 243B | |
+30.66% | 206B | |
+12.13% | 171B | |
+46.25% | 136B | |
-38.21% | 130B | |
+55.23% | 122B |