JASTECH, Ltd. announced that it expects to receive KRW 19 billion in funding
July 19, 2021
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JASTECH, Ltd. announced private placement of series 1 non-guaranteed private equity convertible bonds with bearer type interest part for gross proceeds of KRW 19,000,000,000 with SKS-Yozma New Technology Investment Association No. 1 on July 20, 2021. The bonds will be issued at par, does not bear any interest, and matures on July 23, 2026. The bonds are convertible into 2,303,030 shares representing 13.63% stake at a fixed conversion price of KRW 8,250 per share from July 23, 2022 to June 23, 2026. The bond holder can claim the amount on or after July 23, 2023, and on the day corresponding to every three months thereafter, claim prepayment before maturity. The company shall receive every 3 months and 2 years from the date of issuance of bond may request the buyer to sell part of the bonds, and the bondholder must sell the bonds to the buyer in accordance with this request at a premium of up to 4.04% on face value. the expected subscription date is July 22, 2021 and payment date is July 23, 2021. The transaction has been approved by the board of directors of the company.
JASTECH, Ltd., formerly ASTJETEC Co., Ltd. is a Korea-based company mainly engaged in the manufacture and distribution of semiconductor equipment and laser equipment. The Companyâs main products consist of electro plating systems, electrolytic water jet deflashing systems, chemical dipping water jet deflashing systems, water jet deflashing systems, liquid crystal display (LCD) module bonding systems, light emitting diode (LED) packing equipment, radio-frequency identification (RFID) bonding systems, pump units, touch panels, laser scribers and others. The Company distributes its products within domestic market and to overseas markets.