Sivers Semiconductors AB (publ) announced that its US subsidiary, Sivers Semiconductors Inc., has received a USD 375,000 award under the Defense Advanced Research Projects Agency (DARPA) Next-Generation Microelectronics Manufacturing (NGMM) program in collaboration with PseudolithIC Inc. The program aims to develop three-dimensional heterogeneous integration (3DHI), which involves the heterogeneous integration of disparate materials and components, enabled by advanced packaging that leverages all three dimensions. The DARPA NGMM program is a complementary effort to the US CHIPS ACT, a $52.7 billion program designed to invigorate American semiconductor research, development, manufacturing, and workforce development. Sivers and Pseudolithic will specifically focus on the heterogeneous integration of Sivers' industry-leading, high-performance RF SOI beamformers with III-V front ends for millimeter-wave 5G, SATCOM and defense applications.

Sivers expects all of this revenue to be recognized in 2023.