Soitec announced a new fabrication facility at its headquarters in Bernin, France, primarily to manufacture new silicon carbide wafers which respond to key challenges of the electric vehicle and industrial markets. The extension will also support Soitec's 300-mm Silicon-on-Insulator (SOI) activities. The factory is to produce innovative SmartSiC™ engineered wafers developed by Soitec at the Substrate Innovation Center located at CEA-Leti in Grenoble, using Soitec's proprietary SmartCut™ technology.

The electronic chips built on this type of wafers offer compelling performance and energy efficiency gains to power supply systems. The new generation of silicon carbide wafers adds significant value for industrial applications and electric vehicles. It allows to enlarge their driving range, shorten the charging time and diminish their cost. With its SmartSiC™ products, Soitec is engaged with major silicon carbide device makers and targets to generate first revenues in the second half of calendar year 2023.