On January 24, 2024, Tsinghua Tongfang Co.,Ltd. closed the transaction. The company amended the terms of the transaction. The company issued 9,000,000 scientific and technological innovation corporate bonds at an issue price of CNY 100 per bond for CNY 900,000,000 in its second and final tranche, bringing the total transaction size to CNY 1,200,000,000.

The bonds were slated to be issued for no more than CNY 3,000,000,000. The bonds issued in the second tranche carry a coupon rate of 3.50%, and the subscription multiple was 1.79 times.