Tsinghua Tongfang Co.,Ltd. announced that it will receive investment in a round of funding on December 28, 2023.

On the same date, the company issue a private placement of 3,000,000 scientific and technological innovation corporate bonds at an issue price of CNY 100 per bond for proceeds of CNY 300,000,000 in its first tranche. The transaction included participation from new investor, AVIC Securities Co., Ltd for CNY 30,000,000 along with other investors. The company's directors, supervisors, senior managers, shareholders holding more than 5% of the shares and other related parties did not subscribe for this bond. The bonds were slated to be issued for no more than CNY 3,000,000,000. The bonds carry a coupon rate of 3.30%, and the subscription multiple was 1.96 times. The term of the bonds is 2+1 years, with investors? sell-back options, redemption options and coupon rate adjustment options at the end of the second year. The transaction has been approved by board of directors of the company and the Shanghai Stock Exchange vide Shanghai Securities Letter No. 202313351.