Announcement of the 1st term of the Company's
Remuneration Committee expired
Date of events
2022/06/17
To which item it meets
paragraph 6
Statement
1.Date of occurrence of the change:2022/06/17
2.Name of the functional committees:Remuneration Committee
3.Name of the previous position holder:
(1) Yun Ming Shieh
(2) Wei Hsiung, Yin
(3) Pek Seng Ng
4.Resume of the previous position holder:
(1) Yun Ming Shieh:Chairman & President, Tayllen Industrial Co., Ltd.
(2) Wei Hsiung, Yin:Assistant Vice President, Hon Hai Precision Industry
CO., Ltd.
(3) Pek Seng Ng:Chairman & President, Caleb Professional Consulting Co.,
Ltd.
5.Name of the new position holder:
(1) Yun Ming Shieh
(2) Wei Hsiung, Yin
(3) Pek Seng Ng
6.Resume of the new position holder:
(1) Yun Ming Shieh:Chairman & President, Tayllen Industrial Co., Ltd.
(2) Wei Hsiung, Yin:Assistant Vice President, Hon Hai Precision Industry
CO., Ltd.
(3) Pek Seng Ng:Chairman & President, Caleb Professional Consulting Co.,
Ltd.
7.Circumstances of change (Please enter "resignation", "dismissal",
"term expired", "death" or "new appointment"):Term Expired
8.Reason for the change:Term expired, re-election
9.Original term (from __________ to __________):2019/11/13 to 2022/11/04
10.Effective date of the new member:2022/06/17
11.Any other matters that need to be specified:None
Attachments
Original Link
Original Document
Permalink
Disclaimer
VIA Labs Inc. published this content on 17 June 2022 and is solely responsible for the information contained therein. Distributed by Public, unedited and unaltered, on 17 June 2022 07:42:04 UTC.
VIA Labs Inc is a Taiwan-based company mainly engaged in the provision of Universal Serial Bus (USB) control chip technology and related products. The Company mainly designs, develops and sells USB high-speed transmission control chips, USB Type-C application control chips, USB Power Delivery power transmission control chips, battery charging and related power solution chips, and provides customized services for the chips. The Company's main products include USB4 controllers, USB 3.2 Gen1x1/Gen2x1 controllers, USB Type-C interface controller and product design programs, USB Power Delivery controller and transmission programs, USB 2.0 to 3.2 converter chips, display port to High Definition Multimedia Interface (HDMI) signal converters and others.