Ennoconn Corporation announced that it has received TWD 1.5 billion in funding from VIA Labs, Inc., MediaTek Capital Co., VIA Technologies, Inc. and another investor
August 22, 2021
Share
On August 23, 2021, Ennoconn Corporation closed the transaction. The transaction included participation from PHI Capital, VIA Labs, Inc., MediaTek Capital Co., VIA Technologies, Inc. The bonds will be convertible Shares at TWD 220.7, possible dilution of equity is around 6.56%.
VIA Labs Inc is a Taiwan-based company mainly engaged in the provision of Universal Serial Bus (USB) control chip technology and related products. The Company mainly designs, develops and sells USB high-speed transmission control chips, USB Type-C application control chips, USB Power Delivery power transmission control chips, battery charging and related power solution chips, and provides customized services for the chips. The Company's main products include USB4 controllers, USB 3.2 Gen1x1/Gen2x1 controllers, USB Type-C interface controller and product design programs, USB Power Delivery controller and transmission programs, USB 2.0 to 3.2 converter chips, display port to High Definition Multimedia Interface (HDMI) signal converters and others.
Ennoconn Corporation announced that it has received TWD 1.5 billion in funding from VIA Labs, Inc., MediaTek Capital Co., VIA Technologies, Inc. and another investor
VIA LABS, INC. 
