Ennoconn Corporation announced that it expects to receive TWD 1.5 billion in funding from VIA Labs, Inc., MediaTek Capital Co., VIA Technologies, Inc.
August 10, 2021
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Ennoconn Corporation announced a private placement of 15000 first domestic unsecured convertible bonds at a price of TWD 100,000 for gross proceeds of TWD 1,500,000,000 on August 11, 2021. The bonds will mature in five years and will carry no interest. The Bondholders shall have the rights to require the Company to redeem their bonds in cash at the amount equal to the face amount of the bonds by notifying the Company¡¦s shareholder services agent in writing within 30 days prior to the Record Date
VIA Labs Inc is a Taiwan-based company mainly engaged in the provision of Universal Serial Bus (USB) control chip technology and related products. The Company mainly designs, develops and sells USB high-speed transmission control chips, USB Type-C application control chips, USB Power Delivery power transmission control chips, battery charging and related power solution chips, and provides customized services for the chips. The Company's main products include USB4 controllers, USB 3.2 Gen1x1/Gen2x1 controllers, USB Type-C interface controller and product design programs, USB Power Delivery controller and transmission programs, USB 2.0 to 3.2 converter chips, display port to High Definition Multimedia Interface (HDMI) signal converters and others.
VIA LABS, INC. 
