VIA Labs, Inc. Announces Cash Dividend, Payable on 17 May 2023
March 09, 2023 at 01:45 am EST
Share
VIA Labs, Inc. announced the cash dividend of TWD 516,735,000, each common share is entitled to receive TWD 7.5. The dividend will payable on 17 May 2023. Ex-rights (ex-dividend) record date is 22 April 2023 and ex-rights (ex-dividend) trading date is 14 April 2023.
VIA Labs Inc is a Taiwan-based company mainly engaged in the provision of Universal Serial Bus (USB) control chip technology and related products. The Company mainly designs, develops and sells USB high-speed transmission control chips, USB Type-C application control chips, USB Power Delivery power transmission control chips, battery charging and related power solution chips, and provides customized services for the chips. The Company's main products include USB4 controllers, USB 3.2 Gen1x1/Gen2x1 controllers, USB Type-C interface controller and product design programs, USB Power Delivery controller and transmission programs, USB 2.0 to 3.2 converter chips, display port to High Definition Multimedia Interface (HDMI) signal converters and others.
VIA LABS, INC. 
