Zhejiang Hongfeng Copper Foil Co., Ltd announced that it will receive CNY 45 million in an equity round of funding on April 26, 2023. The total amount included CNY 11.25 million for registered capital and CNY 33.75 million for capital reserve. The transaction will include participation from returning investor Wenzhou Hongfeng Electrical Alloy Co., Ltd. After the capital increase, the registered capital of the company will be increased from CNY 50 million to CNY 61.25 million. Post closing, Wenzhou Hongfeng Electrical Alloy Co., Ltd. equity stake in the company will be increased from 70% to 75.51%. The transaction has been approved by the board of directors of Wenzhou Hongfeng Electrical Alloy Co., Ltd.

On June 2, 2023, the company announced that it has completed the change of business registration of its capital increase.