Aehr Test Systems announced it has received a $1.3 million order from a current customer for two FOX-NP™ systems, adding to their existing fleet to provide additional test capacity for new product engineering characterization and qualification of photonics devices. The FOX-NP Systems are expected to ship within the next few months. The FOX-XP system, available with multiple WaferPak Contactors (full wafer test) or multiple DiePak™ Carriers (singulated die/module test) configurations, is capable of functional test and burn-in/cycling of integrated devices such as silicon carbide power devices, silicon photonics as well as other optical devices, 2D and 3D sensors, flash memories, Gallium Nitride (GaN), magnetic sensors, microcontrollers, and other ICs in either wafer form factor, before they are assembled into single or multi-die stacked packages, or in singulated die or module form factor.