AI/ML's demands for greater bandwidth are insatiable driving rapid improvements in every aspect of computing hardware and software. HBM memory is the ideal solution for the high bandwidth requirements of AI/ML training, but it entails additional design considerations given its 2.5D architecture. Now we're on the verge of a new generation of HBM that will raise memory and capacity to new heights. Designers can realize new levels of performance with the HBM3-ready memory subsystem solution from Rambus.

Download this white paper to:
  • Evolution of HBM standard
  • Design challenges and considerations
  • Features of Rambus HBM3-ready memory subsystem
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Rambus Inc. published this content on 21 September 2021 and is solely responsible for the information contained therein. Distributed by Public, unedited and unaltered, on 22 September 2021 07:11:05 UTC.