Tokyo Seimitsu Co. Ltd. Announces Consolidated Earnings Results for the Nine Months Ended December 31, 2016; Provides Earnings Guidance for the Year Ending March 31, 2017; Provides Dividend Guidance for the Year Ending March 31, 2017
February 13, 2017
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Tokyo Seimitsu Co. Ltd. announced consolidated earnings results for the nine months ended December 31, 2016. For the period, the company reported net sales were JPY 56,697 million, compared to JPY 52,392 million for the same period a year ago. Operating income was JPY 9,744 million, compared to JPY 9,843 million for the same period a year ago. Ordinary income was JPY 9,790 million against JPY 9,997 million a year ago. Net income attributable to owners of the parent of JPY 6,035 million, or JPY 144.92 per diluted share compared to JPY 7,204 million or JPY 173.23 per diluted share, for same period a year ago. Income before income taxes and others was JPY 9,813 million against JPY 10,006 million a year ago.
For the year ending March 31, 2017, the company expects net income attributable to owners of the parent of JPY 9,400 million, or JPY 227.08 per share, net sales of JPY 72,500 million, operating income of JPY 13,000 million, and ordinary income of JPY 12,800 million.
The company provided dividend guidance for the year ending March 31, 2017. For the period, the company expects to pay yearend dividend of JPY 34.00 per share compared to JPY 33.00 per share paid a year ago.
Tokyo Seimitsu Co Ltd is a Japan-based company mainly engaged in the manufacture and sale of semiconductor manufacturing equipment and precision measuring equipment. The Semiconductor Manufacturing Equipment segment is engaged in the manufacture and sale of processing and inspection equipment for the manufacture of semiconductor, such as wafer probing machines and wafer dicing machines, as well as the provision of after-sales services and the development of related software. The Measuring Equipment segment is engaged in the manufacture and sale of precision measuring equipment for three-dimensional (3D) vision systems, as well as surface roundness and profile shape measuring instruments including 3D coordinate measuring machine, true degree and column shape measuring machine, surface roughness measuring machine, wheel shape measuring machine and others.
Tokyo Seimitsu Co. Ltd. Announces Consolidated Earnings Results for the Nine Months Ended December 31, 2016; Provides Earnings Guidance for the Year Ending March 31, 2017; Provides Dividend Guidance for the Year Ending March 31, 2017