Tokyo Seimitsu Co., Ltd. Revises Year-End Dividend Guidance for the Fiscal Year Ending March 2024
November 02, 2023 at 02:00 am EDT
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Tokyo Seimitsu Co., Ltd. revised year-end dividend guidance for the fiscal year ending March 2024. For the year, the company expects to pay year-end dividend of JPY 89.00 per share against previous forecast of JPY 85.00 per share.
Tokyo Seimitsu Co Ltd is a Japan-based company mainly engaged in the manufacture and sale of semiconductor manufacturing equipment and precision measuring equipment. The Semiconductor Manufacturing Equipment segment is engaged in the manufacture and sale of processing and inspection equipment for the manufacture of semiconductor, such as wafer probing machines and wafer dicing machines, as well as the provision of after-sales services and the development of related software. The Measuring Equipment segment is engaged in the manufacture and sale of precision measuring equipment for three-dimensional (3D) vision systems, as well as surface roundness and profile shape measuring instruments including 3D coordinate measuring machine, true degree and column shape measuring machine, surface roughness measuring machine, wheel shape measuring machine and others.
TOKYO SEIMITSU CO., LTD. 
