Tokyo Seimitsu Co., Ltd. Announces Second Quarter-End Dividend for the Fiscal Year Ending March 2024, Payable on December 11, 2023
November 02, 2023 at 02:00 am EDT
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Tokyo Seimitsu Co., Ltd. announced second quarter-end dividend of JPY 89.00 per share for the fiscal year ending March 2024 against JPY 109.00 per share paid for the same period a year ago. Effective date of distribution is December 11, 2023.
Tokyo Seimitsu Co Ltd is a Japan-based company mainly engaged in the manufacture and sale of semiconductor manufacturing equipment and precision measuring equipment. The Semiconductor Manufacturing Equipment segment is engaged in the manufacture and sale of processing and inspection equipment for the manufacture of semiconductor, such as wafer probing machines and wafer dicing machines, as well as the provision of after-sales services and the development of related software. The Measuring Equipment segment is engaged in the manufacture and sale of precision measuring equipment for three-dimensional (3D) vision systems, as well as surface roundness and profile shape measuring instruments including 3D coordinate measuring machine, true degree and column shape measuring machine, surface roughness measuring machine, wheel shape measuring machine and others.
TOKYO SEIMITSU CO., LTD. 
