Tokyo Seimitsu Co., Ltd. Provides Dividend Guidance for Second Quarter and Full Year of Year Ending March 31, 2024
May 12, 2023 at 02:00 am EDT
Share
Tokyo Seimitsu Co., Ltd. provided dividend guidance for second quarter and full year of year ending March 31, 2024. For the second quarter year ending March 31, 2024, the company expects the dividend of JPY 85 per share against JPY 109 per share.
For the year ending March 31, 2024, the company expects the dividend of JPY 85 per share against JPY 126 per share.
Tokyo Seimitsu Co Ltd is a Japan-based company mainly engaged in the manufacture and sale of semiconductor manufacturing equipment and precision measuring equipment. The Semiconductor Manufacturing Equipment segment is engaged in the manufacture and sale of processing and inspection equipment for the manufacture of semiconductor, such as wafer probing machines and wafer dicing machines, as well as the provision of after-sales services and the development of related software. The Measuring Equipment segment is engaged in the manufacture and sale of precision measuring equipment for three-dimensional (3D) vision systems, as well as surface roundness and profile shape measuring instruments including 3D coordinate measuring machine, true degree and column shape measuring machine, surface roughness measuring machine, wheel shape measuring machine and others.
TOKYO SEIMITSU CO., LTD. 
