Tokyo Seimitsu Co., Ltd. Provides Dividend Guidance for the End of Second Quarter and Year Ending March 31, 2023
August 02, 2022 at 02:00 am EDT
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Tokyo Seimitsu Co., Ltd. provided dividend guidance for the end of second quarter and year ending March 31, 2023. For the end of second quarter, the company expects to pay dividend of JPY 109.00 per share against JPY 84.00 per share for the same period last year.
For the year ending March 31, 2023, the company expects to pay dividend of JPY 109.00 per share against JPY 101.00 per share for the same period last year.
Tokyo Seimitsu Co Ltd is a Japan-based company mainly engaged in the manufacture and sale of semiconductor manufacturing equipment and precision measuring equipment. The Semiconductor Manufacturing Equipment segment is engaged in the manufacture and sale of processing and inspection equipment for the manufacture of semiconductor, such as wafer probing machines and wafer dicing machines, as well as the provision of after-sales services and the development of related software. The Measuring Equipment segment is engaged in the manufacture and sale of precision measuring equipment for three-dimensional (3D) vision systems, as well as surface roundness and profile shape measuring instruments including 3D coordinate measuring machine, true degree and column shape measuring machine, surface roughness measuring machine, wheel shape measuring machine and others.
TOKYO SEIMITSU CO., LTD. 
