Tokyo Seimitsu Co., Ltd. Proposes Year End Dividend for the Year Ending March 31, 2023 , Payable on June 27Th, 2023
May 12, 2023 at 02:00 am EDT
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Tokyo Seimitsu Co., Ltd. proposed year end dividend of JPY 126 for the year ending March 31, 2023 compared to JPY 101 a year ago. Effective date of distribution is June 27th, 2023.
Tokyo Seimitsu Co Ltd is a Japan-based company mainly engaged in the manufacture and sale of semiconductor manufacturing equipment and precision measuring equipment. The Semiconductor Manufacturing Equipment segment is engaged in the manufacture and sale of processing and inspection equipment for the manufacture of semiconductor, such as wafer probing machines and wafer dicing machines, as well as the provision of after-sales services and the development of related software. The Measuring Equipment segment is engaged in the manufacture and sale of precision measuring equipment for three-dimensional (3D) vision systems, as well as surface roundness and profile shape measuring instruments including 3D coordinate measuring machine, true degree and column shape measuring machine, surface roughness measuring machine, wheel shape measuring machine and others.
TOKYO SEIMITSU CO., LTD. 
