Tokyo Seimitsu Co., Ltd. Provides Common and Commemorative Dividend Guidance for the Second Quarter and Fourth Quarter of Fiscal Year 2019
August 10, 2018 at 02:00 am EDT
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Tokyo Seimitsu Co., Ltd. expects to pay dividend of JPY 57.00 per share for the second quarter of 2019 compared to JPY 41.00 per share paid for the same period a year ago. The company announced the 70th anniversary commemorative dividend of JPY 10 per share.
The company expects to pay dividend of JPY 57.00 per share for the fourth quarter of 2019 compared to JPY 51.00 per share paid for the same period a year ago. The company announced the 70th anniversary commemorative dividend of JPY 10 per share.
Tokyo Seimitsu Co Ltd is a Japan-based company mainly engaged in the manufacture and sale of semiconductor manufacturing equipment and precision measuring equipment. The Semiconductor Manufacturing Equipment segment is engaged in the manufacture and sale of processing and inspection equipment for the manufacture of semiconductor, such as wafer probing machines and wafer dicing machines, as well as the provision of after-sales services and the development of related software. The Measuring Equipment segment is engaged in the manufacture and sale of precision measuring equipment for three-dimensional (3D) vision systems, as well as surface roundness and profile shape measuring instruments including 3D coordinate measuring machine, true degree and column shape measuring machine, surface roughness measuring machine, wheel shape measuring machine and others.
TOKYO SEIMITSU CO., LTD. 
