Tokyo Seimitsu Co., Ltd. Reports Fourth Quarter Dividend for the Financial Year Ended March 31, 2020, Payable on June 23, 2020
May 11, 2020 at 02:00 am EDT
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Tokyo Seimitsu Co., Ltd. reported fourth quarter dividend of financial year ended March 31, 2020. For the quarter the company reported dividend of JPY 38 per share compared to JPY 66 per share paid a year ago. The dividend is payable on June 23, 2020.
Tokyo Seimitsu Co Ltd is a Japan-based company mainly engaged in the manufacture and sale of semiconductor manufacturing equipment and precision measuring equipment. The Semiconductor Manufacturing Equipment segment is engaged in the manufacture and sale of processing and inspection equipment for the manufacture of semiconductor, such as wafer probing machines and wafer dicing machines, as well as the provision of after-sales services and the development of related software. The Measuring Equipment segment is engaged in the manufacture and sale of precision measuring equipment for three-dimensional (3D) vision systems, as well as surface roundness and profile shape measuring instruments including 3D coordinate measuring machine, true degree and column shape measuring machine, surface roughness measuring machine, wheel shape measuring machine and others.
TOKYO SEIMITSU CO., LTD. 
