Tokyo Seimitsu Co. Ltd. Reports Consolidated and Non-Consolidated Earnings Results for the Year Ended March 31, 2019; Provides Earnings Guidance for the Interim and Full Year of Fiscal Year Ending March 31, 2020
May 14, 2019 at 02:00 am EDT
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Tokyo Seimitsu Co. Ltd. reported consolidated and non-consolidated earnings results for the year ended March 31, 2019. For the year, on consolidated basis, the company reported net sales of JPY 101,520 million compared to JPY 88,194 million a year ago. Operating income was JPY 20,221 million compared to JPY 17,283 million a year ago. Net income attributable to owners of the parent of JPY 14,665 million or JPY 352.92 per share compared to JPY 12,717 million or JPY 306.41 per share a year ago. Diluted net income per share was JPY 350.23 compared to JPY 304.02 a year ago.
For the year, on non-consolidated basis, the company reported net sales of JPY 84,655 million compared to JPY 72,635 million a year ago. Operating income was JPY 13,173 million compared to JPY 11,453 million a year ago. Net income was JPY 11,110 million or JPY 267.37 per share compared to JPY 9,628 million or JPY 231.99 per share a year ago. Diluted net income per share was JPY 265.33 compared to JPY 230.18 a year ago.
The company provided earnings guidance for the interim and full year of fiscal year ending March 31, 2020. For the interim, the company expects net sales of JPY 43,000 million, operating income of JPY 5,900 million, net income attributable to owners of the parent of JPY 4,200 million or JPY 101.00 per share.
For the full year ending March 31, 2020, the company expects net sales of JPY 88,000 million, operating income of JPY 12,500 million, net income attributable to owners of the parent of JPY 9,000 million or JPY 216.00 per share.
Tokyo Seimitsu Co Ltd is a Japan-based company mainly engaged in the manufacture and sale of semiconductor manufacturing equipment and precision measuring equipment. The Semiconductor Manufacturing Equipment segment is engaged in the manufacture and sale of processing and inspection equipment for the manufacture of semiconductor, such as wafer probing machines and wafer dicing machines, as well as the provision of after-sales services and the development of related software. The Measuring Equipment segment is engaged in the manufacture and sale of precision measuring equipment for three-dimensional (3D) vision systems, as well as surface roundness and profile shape measuring instruments including 3D coordinate measuring machine, true degree and column shape measuring machine, surface roughness measuring machine, wheel shape measuring machine and others.
Tokyo Seimitsu Co. Ltd. Reports Consolidated and Non-Consolidated Earnings Results for the Year Ended March 31, 2019; Provides Earnings Guidance for the Interim and Full Year of Fiscal Year Ending March 31, 2020
TOKYO SEIMITSU CO., LTD. 
