Tokyo Seimitsu Co., Ltd. Provides Dividend Guidance for the Year End of Fiscal Year Ended March 31, 2018
February 09, 2018 at 01:00 am EST
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Tokyo Seimitsu Co., Ltd. provided dividend guidance for the year end of fiscal year ended March 31, 2018. For the fiscal year end, the company expects to pay dividend of JPY 41.00 per share compare to JPY 38.000 per share paid in a year ago.
Tokyo Seimitsu Co Ltd is a Japan-based company mainly engaged in the manufacture and sale of semiconductor manufacturing equipment and precision measuring equipment. The Semiconductor Manufacturing Equipment segment is engaged in the manufacture and sale of processing and inspection equipment for the manufacture of semiconductor, such as wafer probing machines and wafer dicing machines, as well as the provision of after-sales services and the development of related software. The Measuring Equipment segment is engaged in the manufacture and sale of precision measuring equipment for three-dimensional (3D) vision systems, as well as surface roundness and profile shape measuring instruments including 3D coordinate measuring machine, true degree and column shape measuring machine, surface roughness measuring machine, wheel shape measuring machine and others.
TOKYO SEIMITSU CO., LTD. 
